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Composite Cu Films
Composite Cu Film
Sangbo provides Industry's Best Performance
Introduction
Composite Copper Film formed with Copper layer on polymer film or glass substrate
Features
Unlike conventional plating or sputtering methods, the process can be simplified with the roll-to-roll wet coating method, and a copper layer is formed by inducing a reduction reaction of Cu ions.
It can implement a uniform copper layer without pin-holes and can be applied to various materials such as PI, PET, LCP, PCT, PSS, low-k films, and glass substrates.
Technical Data Sheet
| Substrate | PI Film(25~50um) | PET Film(50~188um) | Conductive PI Film(15~30um) | Soda LimeGlass | |
|---|---|---|---|---|---|
| Cu Coating side | Single-sided | Single-sided | Single-sided | Double-sided | Single-sided |
| Cu CoatingThickness | 200 ~ 600nm | 200 ~ 600nm | 200 ~ 600nm | 200 ~ 600nm | 200 ~ 600nm |
| Surface Resistance(Ω/SQ) | 0.3 ~ 1.7 | 0.3 ~ 1.7 | 0.2 ~ 1.0 | 0.2 ~ 1.0 | 0.5 ~ 2.0 |
| Adhesion(Cross-Cut) | 5B | 5B | 5B | 5B | 5B |
Application
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